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Bentley's Tiered Offering of Microstran

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Revision 5 posted to Structural Analysis and Design - Wiki by Josh Taylor on 5/8/2014 6:39:32 PM

The features within Microstran available to a given user depend on which tier of Microstran is activated on the respective user’s computer, as well as which design code options are activated (for information on activating products, see [structural_analysis_and_design__wiki:SELECT Licensing of Microstran]. There are three different tiers of Microstran, each containing more features than the last. These tiers are:

  • Microstran
  • Microstran.Pro
  • Microstran.Advanced

In addition to the basic modeling, analysis, design, and interoperability options available in all tiers of the product, Microstran.Pro and Microstran.Advanced contain advanced analysis and element options.

 

Microstran.Pro contains the following features that are not available in Microstran:

  • Dynamic analysis (calculation of periods and modes)
  • Cable element
  • Export to Steel Detailing Neutral Format
  • Reinforced concrete design to AS3600-94

Microstran.Advanced contains the following features that are not available in Microstran:

  • Dynamic analysis (calculation of periods and modes)
  • Cable element
  • Export to Steel Detailing Neutral Format
  • Reinforced concrete design to AS3600-94
  • Application of moving loads
  • Nonlinear gap and fuse elements
  • Response spectrum analysis

 

There are a number of design code standards that can be activated on any of the three Microstran tiers. They allow beam, column, and brace design to specific code standards. They are:

  • AS4100
  • NZS 3404
  • AS/ANZ 4600:05
  • AISC ASD 9th
  • AS 1250/AS3990
  • SSCJ/AIJ
  • BS 5950:2000
  • BS8110:85

 

Steel member design includes requirements for beams, columns, and braces. Concrete member design to AS3600-94 and BS8110:85 includes requirements for beams and columns.

In addition to member design, an add-on for steel connection design within Microstran is available and can be activated on any of the three tiers. This feature is referred to as Integrated Connection Design.


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